Sceptre System Vision Probe

	NOW any CMM can have a multi-sensor -- contact and non-contact -- capability with EMD's SCEPTRE^™ System.
UPGRADE
You can upgrade your CMM with SCEPTRE Vision System and make those two-dimensional vision systems and optical gaging devices obsolete. SCEPTRE Vision has an omni-directional probe and software capable of 2D and 3D non-contact measurements.
SCEPTRE VISION FEATURES
Seamless integration: SCEPTRE Vision is designed for total integration into the SCEPTRE System's operating environment for a completely seamless contact and non-contact continuous scanning capability. SCEPTRE Software commands for the 3D scanning probe operate in an identical manner using SCEPTRE Vision. Measurements by either method are easily combined and appear seamless to the operator.
Larger-than-field-of-view measurements: Measurements made in the field of view are stored within the SCEPTRE System's computer and can be combined with any features or measurements anywhere within the machine volume.
Optical scanning: A unique feature of SCEPTRE Vision, it can simultaneously loop on an edge and track it while measuring, without stopping. It is not limited to the field of view and will track an edge through the entire volume of the machine.
Automatic closed-loop lighting control: In which the computer automatically sets the light intensity of the Ring illuminators, allowing for an automatic thresholding capability for more precise edge detection.
Image contrast auto-focus: Allows the system to make height measurements in addition to the 2D field of view measurements.
Contour scanning in 3D: The vision probe can be used as a light sectioning device. By observing the location of the line section, the system calculates the X, Y, and Z coordinate of any point on the line section within the field of view.
If you need vision, you need EMD's SCEPTRE Vision System. Contact us today for a free demonstration.

Integral Camera: High Resolution High S/N ratio 46 dB Standard NTSC Output after Process/Power Supply Box
Probe Illumination Capability Ring 1: For direct Vertical Illumination of the object surface. Ring is set at 29 degree angle to the imaging axis. Intensity is computer controllable 12 bit (1 part in 4096). Max. illumination capacity is 16,000 mcd, 660 nm monochromatic wavelength LED light source.
Ring 2: More Oblique Illumination of the object surface. Ring is set at 40 degree angle to the imaging axis. Intensity is computer controllable 12 bit (1 part in 4096). Max. illumination capacity is 16,000 mcd, 660 nm monochromatic wavelength LED light source.
Quad I, II, III, IV: Directional Oblique Illumination from the four quadrant corners relative to the field of view. Each quadrant can be separately turned on or off from the computer. At 45, 135, 225, and 315 degrees to the field of view. Light source is set at 50 degree angle to the imaging axis. Illumination capacity 5,000 mcd from each quadrant, 660 nm monochromatic LED light source.
Laser Section: Used for Vertical and Oblique surface measurements along the imaging axis. Diode Laser, 660 nm monochromatic collimated light source projects light section at a 35 degree angle to the imaging axis.

SVP SPECIFICATIONS
Working Distance:	23 mm (0.875 in.)
Field of view:	Horizontal Pixels: 512 Vertical Pixels: 480
Size:	Height: 89 mm (3.5 in.) Width: 70 mm (2.75 in.) Weight: Less than 0.54 kg (1.2 lb.)
Magnification:	30X on 19" SVGA Color Monitor
Mounting: Any orientation or attitude. Probe head allows for flexible fixturing to a variety of mounting surfaces. Simple 1/4-20 threading required on mounting surface. Nine access and counterbored holes available through probe head.